Flip chip (FC) technology is gaining an increased level of importance for a variety of applications based on its board application or in packaging process...
Archiv März 1999
More and more of highly packed SMT boards are subjects for repair They require of course easy and effective solutions that will enable a greater flexibility...
Economy is the driving force to choose a no-clean process in the PCB soldering. But before, often another technique has already been implemented (RMA or...