Rapid thermal shock cycling with temperature ranging from –80 to 220°C provides heavy mechanical stress to materials. Hidden weakness in electronics is...
Archiv September 2000
In applying a metal heat sink to the back side of a flip-chip die, the thickness of the adhesive holding the heat sink in place is critical. The adhesive layer...
Design for testability (DfT) is obviously a very important issue. The discussion started many years ago with the advent of in-circuit test (ICT) and even...
The Esec wire bonder 3088 sets industry standards for speed, precision and bond range when considered against the fast moving pace of package miniaturization...
Datacon’s advanced dispensing system 3000 ads represents an optimal solution for those processes such as glob top, fluxing, dam&fill, underfilling...
Schiller's dam & fill dispenser has now a automatic quantity control and correction system that provides even better results by quick reaction to changes...
A very short tact time of 3s, very high flexibility and ease-of-use are the characteristics of the screen printer Ekra Microtronic 8-DT. Its application is...
Emerson & Cuming presents a robust type of encapsulant for the interconnecting and underfilling area of area array devices. The Amicon E 1340 series of...
Lambda (distributed in Europe by Macrotron Systems) has added the MicroCure CF5100 to the variable-frequency microwave (VFM) systems. The CF5100 is capable of...
Asymtek introduces the DV-7000 Heli-Flow pump. This third generation pump en-sures consistent performance through its rotary positive-displacement auger, and...
