Kulicke & Soffa, headquartered in Willow Grove, PA, continues to distribute Austria-based Datacon’s MCM/flip- chip die bonder line outside of Europe. Just some months before, Datacon became exclusive distributor for K&S‘ wire bonders, dicing machines, encapsulant and flip-chip bumping sevices in Germany, Austria and the Netherlands.
Commenting on the five-year extension of the distribution agreement, Dave Leonhardt, K&S senior VP and general manager, resumes, „We are pleased with the results of our partnership with Datacon. Our customers are welcoming the addition of sophisticated placement equipment, which combines the industry’s highest accuracy with modular process flexibility, to our portfolio of semiconductor assembly solutions.“
Datacon’s managing director Helmut Rutterschmidt underlines, „Our partnership with Kulicke & Soffa already has provided a significant revenue increase by giving us access to markets in the U.S. and Asia. By extending this agreement, and continuing our own aggressive research and development activities, we will increase our global leadership in advanced packaging.“
One year ago, K&S and Datacon initially founded an exclusive distributorship agreement. Since then, the Austrian company has built a further factory at their headquarters to keep pace with growing demand. The company,which employs about 200, reached a total revenue of $50m in 1999, not included the K&S business in Europe, and plans to establish an application lab at its headquarters in Tyrol.
Datacon has set standards with its PPS series, a modular machine platform that can be adapted to very different requirements, to multi-chip modules, flip chips, and high-end die bond applications. Kulicke & Soffa reportedly is the world’s largest supplier of semiconductor assembly equipment. The company provides solutions for wire and die bonding, wafer dicing as well as factory automation and integration and services, including tools and materials. (gbw)
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