Karl Suss has finalized an a-greement with Motorola Labs to offer proprietary mask protection technology (MPT) to its client base. The customer benefit of this technology includes significantly increased device yields through reduction of particle contamination in hard and vacuum contact lithography. For solder bumping where feature sizes are 50 to 100µm and proximity gaps of the same size are typical, the MPT method will not improve yield,as mask and wafer do notrisk contact. However, in gold bumping where gaps are sometimes reduced to 30µm in order to pattern 10µm features, MPT is expected to help maintain the high process-yield known from larger gaps.
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