The Paste Puck from Crossflow is a simplified, low-cost, pressurized printing system which tightly seals the solder paste from environment during processing. The mechanism using Semco cassettes is designed for use on semi-automatic stencil printers.Easy to install and independent of printer software, the Paste Puck reportedly cleans up the process, leaving no discernible traces of solder paste on a stencil sur-face. Isolating paste within the Puck and away from the effects of the environment, it eliminates drying and crusting while on the stencil, drama-tically reducing waste and the associated costs. Paste wastage of less than 0.5% can be achieved.
Positive pressure printing ensures better opening fill, especially where fine line and ultra-fine line apertures are the order of the day. It produces crisp, accurate paste deposits that are consistent across the board and are repeatable throughout the process. With the Puck, the initial outlay in many instances can be recouped in a matter of months and, thereafter, considerable material savings are said to accrue.
The Puck seals with the stencil through a media print gasket. Available in two window sizes, 300 and 380mm, each print window can be tailored to a specific print pattern size with the use of trim tab reducers, ensuring optimum utilization of the print medium. Most solder pastes can be left in the Puck overnight, resting on the stencil, and will print easily the following morning, reducing the need for cleaning, and again reducing waste. If required, the paste can be sealed within the Puck removed from the machine for long-term storage. The Puck can be replaced by a conventional squeegee in a matter of minutes. It uses the paste cassettes developed by Semco under license from DEK. (gbw)
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