Systems-on-a-chip (SoC) are marking the beginning of the next epoch of circuit integration. Virtually the entire functions of an electronic system can now be...
Archiv Mai 2000
T-mate, a material from Thermagon, is designed to adhere to a heat spreading device, while separating cleanly and easily from the chip or component, when...
MLT specializes in the manufacturer and custom formulation of UV-curable resin systems. The product line consists of adhesives, coatings, encapsulants and...
Amkor now offers a near CSP plastic encapsulated package with copper leadframe substrate. The package is extremely space saving. As compared to the TSSOP...
Emerson & Cuming introduces two formulations for no flow-fluxing underfill of flip-chip devices. The Amicon E 1330 series does not cure through solder...
Techcon's dark amber, non-carbon dispensing barrels is de-signed for users of UV-curable adhesives. Although translucent, this material still provides...
Asymtek has released the Millennium M-620 system. based on the company's M-600 dispensing platform. The M-620 represents a solution for dispensing processes...
Hesse&Knipps has introduced its Deep Access rotary bondhead for the Bondjet 710/810 series, adding even more flexibility to their existing platform of...
Die attach challenges continue to appear for equipment manufacturers as well as for users and circuit designers. Requirements calling for minimal transmission...
Although wire bonding dominates the IC packaging market in volume, most of the industry "buzz" has focused around advanced techniques, such as chip scale...