The Esec Group (Cham, Switzerland) and Orthodyne (Irvine, CA) have collaborated to integrate the Orthodyne 360C-HD dual head wire bonder in Esec’s automation...
Archiv September 2000
Tecnomatix, market leader in e-manufacturing solutions across the enterprise, and Orbotech, a leading vendor of AOI systems for the PCB industry, have signed a...
Gifted research and development, combined with crea-tive marketing: these are thebusiness principles of the Dr.O.K.Wack Chemie in Germany. Now, the company has...
The industry's most widely used acceptability document has been given a major new upgrade with the release of IPC-A-610C, acceptability of electronics...
DEK has said that its PumpPrinting process has reached a level of refinement that is making glue dispensers obsolete. PumpPrinting is fast, highly repeatable...
The Paste Puck from Crossflow is a simplified, low-cost, pressurized printing system which tightly seals the solder paste from environment during processing...
As Europe’s electronics industry continues to develop to meet rapid changing technology, legislation and demand, the challenges facing equipment...
Rolf Ludwig Diehm, Seho; Werner Kruppa, Multicore; Armin Rahn, rahn-tec
Teradyne introduced its Optima 7300 post-reflow automated inspection system, the first in a series of next-generation machines. A single system can inspect the...
Palomar’s CBT 6000 bonder represents an enabling technology for WsCSP. As the only wirebonder able to process an entire wafer at a time, the CBT 6000 offers...