Asymtek has updated its software Easy Coat for Windows NT, which is used with the Century selective conformal coating systems. With the updated version, a BMP...
Archiv Februar 2002
The major application areas of the desktop workstation Uni-Base from Weld-Equip are thermode soldering and heatseal bonding of flex-cable connectors to PCBs or...
The CL200 cleaner/SOI bonder from Karl Suss cleans, dries, aligns and bonds all in one closed chamber. The system is specially designed for creating...
Palomar has developed equipment for the manufacture of coaxial laser packages, in which a pulse heat system enables the assembly of edge emitting lasers inside...
Datacon introduces its next-generation multi-chip die bonder 2200 apm+, an extension of the pro-ven modular platform concept foradvanced packaging, offering...
Spirig supplies a micro-wire router/implanter to manufacture smart-cards or other remote readable identifier tags. It produces two-dimensional antenna or coil...
Producing significantly increased performance over previous systems, the model 4300 is ideal for high-speed laser trimming of thick-film hybrid and surface...
Amadyne’s semiautomated pick&place system is capable of handling a wide range of dies and other components, including single-chip, multi-chip, COB...
The hermetic sealing systems Generation 2 from Weld-Equip are able to automatically seal metal and ceramic packages. The glove box offers a dry nitrogen...
Nickel evaporation masks for use in selective vacuum chamber deposition processes, such as gold and silver plating on silicon, have been developed by Tecan...
