Epoxy writer for modular MCM die bonder

As an extension to its 2200 apm modular machine concept for single-die and MCM attachment, Datacon has developed the compact epoxy writer EWR. This gear saves clean-room resources with optimized footprint, and works particularly efficiently in dual configurations. Its speed reaches from more than 2000 devices per hour (dies greater than 15mm), to up to 5000 for dies under 5mm in dispense operation. The module can be fitted with epoxy cartridges of up to 30ccm. With this equipment, all standard dispensable and stampable bonding materials can be used. It is possible to apply freely programmable patterns, lines or dots with high precision. All sizes of commonly used materials can be processed, for BT substrates (laminates), copper leadframes and flat Auer boats with widths of 15 to 100mm, lengths of 150 to 300mm and thicknesses of 0.2 to 2mm (leadframes down to 0.1mm). For ceramic and FR4 substrates, widths and lengths of 50 to 100mm are possible with thicknesses of between 0.2 and 2mm. The EWR is suitable for applying the epoxy via a stamping process. Here, the unit is just as fast as with dispensing, and is used for die sizes of 0.17 to 0.5mm. Integration is provided via CAN bus, conveyor inputs, grab indexers, loaders and buffer storage.

EPP 222