First vacuum in-line flow system

Pink’s Vadu 300 is the first soldering system using a vacuum inline method in order to solder in a continuous process. This means considerably improved, cavity-free results and shorter cycle times. The method is also energy-saving and suitable for practically all materials and component geometries. The basic version consists of three chambers that are separated by vacuum-sealed slide valves. The processes that take place in the chambers (inward locking, soldering and cooling/outward locking) independently. As soon as a frame moves into the inward locking chamber and the slide valve is closed, the chamber is evacuated and then flooded and rinsed with inert gas. This way, the components are pre-cleaned. The second chamber evacuation and flooding cycles are also carried out before the heat is raised to soldering temperature in order to guarantee a defined and reproducible process. As soon as temperature is reached, a plate heated to a constant temperature (the surface can go up to 450°C) moves from below against the soldering batch located in the transport frame and soldering process can begin. Due to the constant temperature, the otherwise necessary heating-up and cooling-down phases of the heat source can be dispensed with – process time is saved. The component temperature is detected directly. The data are used to regulate the process. As soon as soldering is completed, the batch is automatically transported into the third process chamber to cool off. To ensure fast cooling, a plate docks onto the batch from below. This contact cooling is supported by fan which circulates the inert gas atmosphere.

EPP 195