Heraeus introduced TF38, a no-clean flip-chip flux that is compatible with virtually all underfill compounds. It features ultra-low residues of less than 20%, and robust wetting with a wide process window. Unlike fluxes, which are rosin or resin-based, TF38 is composed of synthetic oligamer chains that are designed to crosslink with the underfill, creating a system bond between the residue and the underfill. Since rosin and resin act as fillers, rather than crosslinking, they can lead to delamination of the board and components, which cannot occur with the chemistry of TF38. The low residue levels ensure that there is no interference with the capillary fill action of the underfill. The solvents and activators in the flux are designed to volatilize completely, leaving the residue ready to bond with the underfill.
EPP 184
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