MRSI has introduced combined microstamping with positive displacement pump dispensing of conductive epoxy for very fine deposition. Ever-decreasing circuitry geometry has necessitated microstamping which allows for epoxy deposits down to 0.005-in. Additionally, the volume of the deposit is greatly reduced by microstamping versus dispensing due to a much smaller cross-section. The combination of microstamping with traditional pump dispensing offers the ability to accommodate small sizes, as well as to maintain speed. The microstamping tool is placed into a rotating well of epoxy that is constantly leveled by a micrometer-adjustable „doctor blade“. Once the epoxy is taken, the system applies it to the location by lightly touching down with the compliant tip. The two heads of the gear can be configured with either two positive displacement pumps or with one dispense and one stamp head. The pump can dispense accurately individual dots, lines and areas at production rates.
EPP 221
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