PumpPrinting set to kill off adhesive dispensing

DEK has said that its PumpPrinting process has reached a level of refinement that is making glue dispensers obsolete. PumpPrinting is fast, highly repeatable and offers consistently accurate deposition for high end-of-line yield. When used in conjunction with the DEK ProFlow head, performance is further enhanced. „Some customers are achieving cycle time savings greater than 50s per board, simply by discarding their dispenser and moving to PumpPrinting,“ said Steve Collier of DEK. „ProFlow aids filling of the stencil apertures, and has eliminated the requirement for extended kneading of the adhesive.“ Many users implement the process quickly and cost-effectively by using an existing printer, such as a DEK 265. The machine can also be quickly reconverted to print solder paste or other electronic materials as required, which means the company retains the flexibility to manage resources effectively. The latest techniques employed by the DEK PumpPrinting process include underside-routed stencils, to clear components or solder paste on the surface of the board. This allows PumpPrinting to address an even wider range of applications. „We work closely with our customers, and can quickly generate a stencil from CAD data,“ concluded Collier. „The component list enables us to optimise the thickness of the stencil and height of each deposit. A complete PumpPrinting stencil can typically be turned around in four to five days.“

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