[1] Entnommen dem Abschnitt „Board Assembly“ in der 2007 iNEMI Roadmap
[2] Barbini, D.: “Implementation of a Lead Free Wave Soldering Process: An in-depth Look at the Critical Issues”. Januar 2005, Proceedings of 10th Annual Pan Pacific Microelectronics Symposium, Kaui
[3] Marquez, U., Barbini, D. und Szymanowski, R.: “Selective Soldering with Sn3.9Ag0.6Cu: Process Development”. September 2004, Proceedings of SMTA International Conference, Rosemont, IL
[4] Vitronics Soltec: “Selective Soldering in the Lead-Free Era”. Oktober 2006, On-board Technology Magazine
[5] Dalderup, M., Barbini, D. und Diepstraten, G.: “Selective Soldering with Lead-Free Alloys”. September 2003, Proceedings of the SMTA International Conference, Rosemont, IL
[6] Marquez, U.: “Lead Free Wave Soldering”. Juni 2006, Präsentation, Chicago, IL
[7] Engineering Statistics Handbook (www.itl.nist.gov/div898/handbook/pri/section5/pri56.htm)
[8] Diepstraten, G. und Marquez, U.: “Evaluation of Optimized Soldering Processes on Defect Minimization and Solder Joint Formation. April 2006, Vitronics Soltec Präsentation bei dem Elcoteq Competence Group Meeting
Unsere Webinar-Empfehlung
SAKI is a Japanese supplier of SPI, AOI, AXI, THD and coating inspection solutions as an all-in-one hardware and software platform.
Teilen:
