With its paste formula EE165-3, Epoxy Technology delivers a silver-filled conductive adhesive that is suited for solder replacement and SMT applications on rigid boards. The silver-colored, two-component material is designed for Sn/Pb electrodes, for chip packages as well as discrete components. It is being applied in a mix ratio of 100/3. The material features a moderate viscosity of 20,480 cPs. Thixotropic index is 4.8. After curing (150°C/60 min, 125°C/2 hours) Shore D hard-ness measures 80 to 82, lap shear strength is 1,392 psi and die shear strength is >10kg/340 psi. The material endures operating temperatures of -55 to +155°C, and intermittently from -55 to 300°C. The glass transition temperature is at 93°C. Moisture resistance is given as a 1.97% increase. Pot life is given as >2 days, and shelf life as one year at room temperature. ws
Fax: +1-978-663-9782
+49-7243-699 44
EPP 175
Unsere Webinar-Empfehlung
Applikationen aus dem Bereich der Leistungselektronik gewinnen immer mehr an Bedeutung. Die Inspektion dieser Applikation lässt sich mit der bewährten Standardtechnologie der 3D-Messtechnik bewerkstelligen.
Teilen:
