Datacon, Austria, a leading supplier of advanced-packaging equipment in Europe, is offering technology seminars free of charge. The tutorials will focus on putting packaging technology into practice. The next event (September 27th, Competence Center in Radfeld/Tyrol) will be on flip-chip device packaging. The company, a specialist in this field right from the start, will support the industry in its effort to provide leading-edge manufacturing methods by revealing the underlying processes, special features and the pros and cons of this technique. Real-life experience will provide an insight into the potential offered by flip-chip packaging. For registration please contact Monika Walcher, Datacon, Innstr. 16, A-6240 Radfeld, Austria, Tel +43-5337-600-104, Fax +43-5337-600-695,
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