X-ray patent enhances quality of rework

Glenbrook Technologies has been awarded a broad and fundamental patent for the integration of real-time X-ray inspection with the BGA/CSP rework process, United States patent #6,009,145. On these devices, the connections are located on the underside of the package. While area-array packages offer processing and performance advantages over peripherally-leaded devices, they present both inspection and rework challenges, since their connections cannot be seen once they have been attached to the circuit board. Glenbrook’s patented system is designed to facilitate the repair of assemblies with BGAs and CSPs by monitoring the rework process in action. This is the first system that permits the stages of solder reflow – surface tension alignment, solder ball collaps and cool-down – to be observed continuously, as they occur. Real-time x-ray imaging of the reflow process supports monitoring of BGA / CSP rework and repair. The system incorporates a rework station, in which the platens are made of relatively X-ray transmissiv materials, in combination with a real-time X-ray inspection system that captures the hidden action of the reflow process. Should a defect such as misalignment or incomplete reflow occur during rework, the process can be rectified before the assembly is returned to the line.

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EPP 158