The Global Head of Marketing at Heraeus Electronics, Mark Challingsworth discusses two new solder pastes that were exhibited at the SMT Hybrid Packaging show, as well as, explains their target groups. As electronic components are becoming smaller and more compressed on a board, a lot can impact its performance, which is why using the correct paste is very important. Mr. Challingsworth further discusses what 2018 has been for the company and its market, and developments that will continue into the future. He stresses that the automotive and electronic market is on the rise, and will definitely continue to improve.
Interview with Manu Vaidya, Global Product Manager, Heraeus Deutschland. A new…Mehr Details
Jörg Trodler: Weil manche Materialkombinationen nicht miteinander harmonieren,…Mehr Details
Jörg Trodler, Technical Solution Manager Assembly Materials, Heraeus Deutschland…Mehr Details