300-mm multi-chip die bonding

Datacon introduces its next-generation multi-chip die bonder 2200 apm+, an extension of the pro-ven modular platform concept foradvanced packaging, offering 300-mm wafer handling. This multi-chip die bonder is the first on the market ready for the transition to 300mm wafers, and is built on the same concept as the proven pre-decessor system, capable of working on large dies up to 50mm for die attach and flip chip. This generation of die bonders integrates seamlessly into the modular platform concept, ensuring flexibility and reliability. With higher advanced packaging requirements, more assembly lines require a large degree of modularity. Different modules can be arranged consecutively, so that either the throughput can be multiplied or all kinds of different tasks can be processed in parallel. The flexibility of the 2200 apm+ is reflected in the MCM capability by automatic wafer changing, automatic tool changing, multi-chip ejector carrousel system, die attach and flip-chip capabilities, and compliance with the Semi SECS standards. This machine is reportedly the die bonder with the smallest footprint in its class, of great importance for cleanroom cost control.

EPP 200