Palomar’s CBT 6000 bonder represents an enabling technology for WsCSP. As the only wirebonder able to process an entire wafer at a time, the CBT 6000 offers a suite of WsCSP tools. By utilizing high wire capacity, wafer programming tools, wafer mapping, ink dot recognition, barcode scanning, wafer teach tools, deformation monitoring, and easy-to-use software, users can realize increased productivity and yield. In contrast to singulated chip processing, the large 300 x 150mm work area allows an entire wafer to be bonded at one time. Utilizing special dual-lane handlers, it can bond a wafer in one lane, while asecond wafer is indexing into the other lane. This complete-ly eliminates index time inwafers of 150mm diameter or less.
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