The CL200 cleaner/SOI bonder from Karl Suss cleans, dries, aligns and bonds all in one closed chamber. The system is specially designed for creating silicon-on-insulator (SOI) substrates, a very promising semiconductor material for leading-edge devices such as low-power and high-speed LSIs, smart sensors and smart-power devices. The equipment processes two wafers simultaneously without separation between process steps. The closed chamber acts as splash protection and creates a mini-environment with a controlled cleanroom nitrogen atmosphere. The semiautomatic machine can be upgraded to a fully automated substrate bond cluster.
EPP 201
Unsere Webinar-Empfehlung
Die Nutzung der 3D-Mess- und Prozessdaten bringt die Produktionssteuerung auf die nächste Stufe. Echte 3D-Messung ermöglicht KI-basierte Prozessmodellierung zur Vorhersage von Parameteränderungen und -defekten oder zur Ursachenanalyse bis hin zu einzelnen Werkzeugen und Best…
Teilen:
