Glenbrook’s Jewel Box 90c real-time X-ray inspection system (progressive 15 to 500X magnification) offers a resolution of 5µm (at a source voltage of 90kV). It accommodates boards up to 18 x 18-in. Like its predecessors (with 70kV anode voltage), it generates high-quality images of solder joints and bonds in BGAs that are out of reach for verification through visual inspection. Soft materials such as molded plastics and encapsulants, components and assemblies can be verified as well. The instrument operates on 120V/60Hz or 220V/50Hz mains. As a desktop system, it has a small footprint of 27 x 29-in, height is 30-in. It comes in a transparent enclosure for easy viewing from any angle. The box offers adjustable part holders and a 5-axis joystick-controllable positioner. The image processor has advanced image transfer capabilities. Optional features are: BGA analysis and measurement software to automatically locate and measure BGA solder joints. A video printer for hardcopy output is available, as is a wheeled cabinet base for use of the unit in multiple locations.
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Auch dieses Jahr präsentiert Koh Young wieder aktuelle Trends und „State of the Art“ Technologie aus der optischen Inspektion und 3D-Messung auf der Productronica in München. Aber wir alle kennen das Problem voller Terminkalender, Reisebeschränkungen oder fehlender Zeit, um in…
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