The Finetech Fineplacer Pico is an automatic flip-chip bonder and placement system for opto-electronic devices, featuring position accuracy better than 5µm with the means of a vision alignment system. A bond-ing force sensor, which is integrated in the pivot arm, guarantees a stress-free placement touchdown of the components, and is the basis for the force regulation of the complete bonding process. The modular concept covers dif-ferent mounting and bonding techniques simply with a module change. Modules for thermo-compression, ultraso-nic, thermosonic, UV-cure, hot-gas and dispensing are avail-able.
EPP 193
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Die 3D-Messung und Inspektion des Lotpastendrucks ist ein wichtiges Qualitätswerkzeug. Dieses funktioniert nur mit den richtigen Toleranzen und Eingriffsgrenzen.
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