Emerson & Cuming introduces two formulations for no flow-fluxing underfill of flip-chip devices. The Amicon E 1330 series does not cure through solder reflow, allowing easy and comprehensive flip-chip removal and rework. This achieves a less costly and simplified assembly process because it requires no fluxing, flux cleaning, capillary flow underfill and post-cure operations. The system works with eutectic and high-temperature solder spheres. The underfiller cures within a modified reflow cycle immediately after forming the solder joints, also requiring no post cure. The Amicon system provides solder flux and underfill in one single product, and achieves SMT-process compatible flip-chip production. It eliminates flux residues and improves underfill adhesion and reliability. ws
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