High-speed in-line inspection

As revolutionary Leica describes the performance of its IRIS 1000 vision AOI system. Fast and accurate inspection is achieved through the combination of a multi-spectral sensor and parallel image processing with a novel lighting technique (strobe for sharp edges and shadows plus scanning laser). For 2D measurements, the coverage is 100% for paste area, xy position and bridging (dynamic repeatability 5%). For 3D measurements, coverage of solder paste height, volume and profile approaches 100% (dynamic repeatability 7%). The stage xy point-to-point repeatability is 10µm. Pixel resolution is 1mil. In addition, IRIS 1000 offers easy board programming in less than 15 minutes(with CAD data). Due to algorithms and acquisition methods, the system achieves high repeatability in conjunction with a low number of false calls. Standard hardware construction should yield lower cost of ownership and maintenance. The display shows the scanned PCB image with defects highlighted, and in addition a spreadsheet with data for area, height, volume bridging and xy position. Individual defects can be zoomed in. With these specs and capabilities, core applications of the instrument are in solder paste measurement, component placement (pre-reflow) and post-reflow measurements.

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EPP 193