Shipley provides Circuposit 4000, a self-accelerating electroless copper technology for horizontal metallization of PCBs. Designed for excellent performance in small holes, the process features reportedly good surface distribution and high throwing power. The process efficiency benefits horizontal processing – including better handling of thin layers, reduced cycle times and more flexible product scheduling. It is ideal for production of complex 3D structures including blind, micro, buried and double-sided vias as well as very fine tracks. It offers good ad-hesion to advanced dielectrics used in sequential build-up (SBU) PCB manufacturing, and is suitable for high aspect-ratio through-hole plating.
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