Quad has improved the placement process capability of its APS-1 advanced packaging systems. The specification is now ±12 microns @ 3-Sigma repeatability. This represents a substantial improvement in the ability to place finest pitch flip chips. The APS-1 is used for precision attachment of dies or chips to a substrate, and meets the unique assembly needs of the hybrid market. Quad also announcesd that it has begun shipping a high-efficiency, small-die handling option for the APS-1 and APS-1H. This option consists of specialized tooling and advanced algorithms for small dies presented on grip rings or standard film frames. Enhanced algorithms compensate for pick-up tool runout and ensure that the tool tip is precisely centered over each small die. Users can now process dies down to 0.2 mm at high yields.
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Conformal Coating ist ein wichtiges Verfahren, um elektronische Baugruppen vor dem vorzeitigen Ausfall zu schützen. Damit bekommt der Beschichtungsprozess eine immer höhere Bedeutung. Dabei ist die Auftragsstärke ein wichtiges Qualitätskriterium. Nur eine zeitnahe schnelle Messung…
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