Amkor now offers a near CSP plastic encapsulated package with copper leadframe substrate. The package is extremely space saving. As compared to the TSSOP, Amkor’s Micro Leadframe realizes a board space reduction of 50%. Nominal height when mounted is 0.9mm. The package is available for 6 to 52 I/Os. It comes in standard body sizes and lead counts. Solder plating is 85/15 Sn/Pb. The Micro Leadframe package employs perimeter lands on the bottom to provide the connections to the board. This construction enables the use of standard leadframe process elements. It also achieves good thermal performance, whereby the die-attach paddle is exposed on the bottom of the package. This provides a direct heat path when soldered to the board. Moisture sensivity characterization: Level 1 Jedec, 85/85 168 hrs., 3x 240°C. The package is shipped in antistatic tubes or in tape and reel. Various test services are available. ws
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Conformal Coating ist ein wichtiges Verfahren, um elektronische Baugruppen vor dem vorzeitigen Ausfall zu schützen. Damit bekommt der Beschichtungsprozess eine immer höhere Bedeutung. Dabei ist die Auftragsstärke ein wichtiges Qualitätskriterium. Nur eine zeitnahe schnelle Messung…
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