Fuji has introduced the multi-functional SMD placement machine QP-3 with a space saving footprint less than 1.9sqm. Its size, speed and flexibility make it reportedly ideal for supplement of a chip shooter or acting as a stand-alone machine. Furthermore, this platform can be changed to meet other circuit assembly needs. This includes glue dispensing (a screw-driven adhesive pump can be installed in place of one or more noz-zle shafts), odd-form placement (installing a special head) and die mounting (addition of linear scales and fluxing capability).
EPP 185
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Auch dieses Jahr präsentiert Koh Young wieder aktuelle Trends und „State of the Art“ Technologie aus der optischen Inspektion und 3D-Messung auf der Productronica in München. Aber wir alle kennen das Problem voller Terminkalender, Reisebeschränkungen oder fehlender Zeit, um in…
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