Universal’s GSM platform features a raised positioning system for inserting both through-hole components as well as placing SMDs up to 51mm tall, including BGAs. The elevated gantry assembly cell is available as a single-beam (GSM1) or dual-beam (GSM2) version. It comes with a four-spindle high-force placement head that exerts a maximum insertion force of2 grams, and is delivered with the GSM platform OFA vision system. Accuracy (w0.076mm at 1.5cpk at 56) is achieved through linear-scale encoders. Numerous interchangeable feeders, cameras, and up to eight active nozzles provide high flexibility. Staged board handling is standard. Brush-less DC servo motors ensure fast and smooth positioning. The GSM2 platform connec-tor assembly cell with a dual gantry and four-camera vi-sion system provides high throughput (3,600cph) for through-hole and odd-form assembly. The GSM2 connector is automated to offer high performance and standardization. A floating servo gripper insertion head reduces the need for custom tooling. Insertion force is 10.6kg. Finally, Universal’s straddle mount assembly tool combines SMT, through-hole, and side-mount connector assembly within a standard SMT machine. It is compatible with the GSM platform.
EPP 170
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10.10.22 | 10:00 Uhr | Conformal Coating ist ein wichtiges Verfahren, um elektronische Baugruppen vor dem vorzeitigen Ausfall zu schützen. Damit bekommt der Beschichtungsprozess eine immer höhere Bedeutung. Dabei ist die Auftragsstärke ein wichtiges Qualitätskriterium. Nur eine…
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