Macrotron Process Technologies presents the new paste inspection system MSV-1B, on OEM product from Samsung. The application of two cameras results in a high throughput along with excellent accuracy. One camera inspects chip components and ICs with a resolution of 40µm, while the high resolution camera checks the fine-pitch parts with a resolution of 15.6µm. The inspection time is 0.17s per frame. Unwelcome features in the picture are eliminated by combining rings of light with different angles and subsequent intelligent image processing. This improves the degree and reliability of recognition. The inspection system detects defects like changes in area, scratches, shorts and unwelcome materials in the paste. This is achieved by image processing through analysis of the paste’s shape and area on the pad. Inspection programs are generated by either using CAD data (Gerber) or by manual teaching of the PCB. Both are possible in an off-line mode which allows for an uninterrupted run of the system in production.
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SAKI is a Japanese supplier of SPI, AOI, AXI, THD and coating inspection solutions as an all-in-one hardware and software platform.
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