Post-solder AOI system for board bottom side

Teradyne has introduced the Optima 7350 post-solder bottom side AOI (automated optical inspection) System, the industry’s only kind of gear presenting full solder defect coverage. It offers high-throughput and matches line beat rates regardless of assembly size or density. The system inspects the full spectra of component and solder defects, including presence, part size, alignment and orientation, placement accuracy and integrity of solder, reportedly to provide an extremely low false flag/accept rate. The machine shares robust software and hardware technology with other systems. The 7350 model inspects the board from the bottom in its native position, ideal for verification of pre and post insertion defects in compliant and VHDM (very high density modular) connectors on double-sided assemblies as pre- and post-wave inspection of through-hole components. Native bottom side inspection eliminates the need for board flipping and avoids higher costs and floorspace requirements. By employing the system at key process positions, users can confirm factors such as component and pin alignment, thereby avoiding assembly errors prior to soldering, then inspect again after soldering to assure solder joint quality. Detecting and identifying defects at these points allows to improve downstream quality and yields while providing valuable process-control data. The system combines image-capture, camera and lighting technologies to deliver the highest avail-able throughput with 100% defect coverage as the supplier claims.

EPP 240