ERA Technology is launching Micro-Screen, a high performance, low-cost and flexible technique for high-density thick film circuits. By using the µ-Screen it is possible to print high-definition tracks and spaces of just 50µm, reducing circuit size and multi-layering without recourse to more expensive photoimageable and thin film techniques. The aim was to produce a low cost technique for the production of high-density thick film circuits using conventional screen printing equipment. The method does not require any further investment and is suitable for regular printing machines employing a standard screen frame for normal off-contact mode printing. µ-Screen facilitates reduced circuit dimensions and the use of high-density interconnect components. The results are impressive with improved edge definition and the ability to produce radial and circular tracks without random edge affects.
EPP 230
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Conformal Coating ist ein wichtiges Verfahren, um elektronische Baugruppen vor dem vorzeitigen Ausfall zu schützen. Damit bekommt der Beschichtungsprozess eine immer höhere Bedeutung. Dabei ist die Auftragsstärke ein wichtiges Qualitätskriterium. Nur eine zeitnahe schnelle Messung…
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