T-mate, a material from Thermagon, is designed to adhere to a heat spreading device, while separating cleanly and easily from the chip or component, when rework is needed. It consists of a non-stick surface of malleable metal alloy, combined with phase change material. This design yields exceptionally low thermal resistance. T-mate can be applied at room temperature. When heated to 70°C, and under pressures as low as 5 psi, T-mate flows to fill any surface irregularities. The results is a neat, clean bond line with no excessive squeeze-out.
Fax +01-216k-741-3943
EPP 221
Unsere Webinar-Empfehlung
SAKI is a Japanese supplier of SPI, AOI, AXI, THD and coating inspection solutions as an all-in-one hardware and software platform.
Teilen:
