Dynatex offers the world’s first 150mm scriber/breaker for GaAs/silicon 4 and 6-in wafer (distributed in Europe by Macrotron Systems). The GST series is designed to provide a dry process to separate dies effectively. The performance of these sensitive chips is compromised when exposed to a wet dicing process. The Dynatex dry process solution is designed to work in cleanroom environments, eliminating the need for waste water disposal and improving the speed and efficiency of the dicing process. Perfect for III-V substrates and materials, like silicon-on-insulator, the scribe-and-break technique is the best solution for high precision wafer die separation. The GST-100 (100mm wafer) as well as the GST 150 (150mm) are available with the Windows NT operating system. The library includes interfaces for equipment components such as robots, motion control, I/O and machine vision. The system offers substantial machine operations flexibility with respect to custom functionality and expandability.
EPP 207
Unsere Webinar-Empfehlung
.png)
Auch dieses Jahr präsentiert Koh Young wieder aktuelle Trends und „State of the Art“ Technologie aus der optischen Inspektion und 3D-Messung auf der Productronica in München. Aber wir alle kennen das Problem voller Terminkalender, Reisebeschränkungen oder fehlender Zeit, um in…
Teilen:
