Amadyne’s semiautomated pick&place system is capable of handling a wide range of dies and other components, including single-chip, multi-chip, COB, flip-chip, chip-on-chip etc. Dies ranging from 0.5 x 0.5mm up to 25 x 25mm can be handled in all commonly available presentation forms. It even offers full 300mm wafer processing capability. The system, which has an effective working area of 400 x 400mm, can be used for bonding, dispensing and component testing. The head is mounted on a custom Z-guide, which offers a travel range of 100mm. It features a monochrome CCD camera (color optionally) and a tool holder for standard 1/8-in die bonding shanks. Both available cameras have standard field view of about 8 x 10mm, resulting in 10µm resolution, optional variations ranging from 5 to 50µm. The tool holder is capable of unlimited 360° rotation and provides vacuum and inert gas blowing.
EPP 196
Unsere Webinar-Empfehlung
10.10.22 | 10:00 Uhr | Conformal Coating ist ein wichtiges Verfahren, um elektronische Baugruppen vor dem vorzeitigen Ausfall zu schützen. Damit bekommt der Beschichtungsprozess eine immer höhere Bedeutung. Dabei ist die Auftragsstärke ein wichtiges Qualitätskriterium. Nur eine…
Teilen:
