Wire bondhead adds even more flexibility

Hesse&Knipps has introduced its Deep Access rotary bondhead for the Bondjet 710/810 series, adding even more flexibility to their existing platform of fine-wire wedge bonders. Like the conventional 45° and the 60° rotary bond-head, the Deep Access is designed to bond fine aluminum and gold wires from 17,5 up to 50µm. Moreover, the advanced design of the bondhead, using piezo-technique, guarantees maintenance-free operations and a highly reliable bonding quality. Based on a modular bondhead concept, the Deep Access is engineered to allow automated bonding of very complex parts such as hybrids or MCMpower connections as well as microwave applications, making production in this segment more profitable. The very large working area (305 x 80mm) of the Bondjet 810, for instance, combined with this bondhead now allows bonding packages in standard carriers, increasing output performance while saving application specific intermediate indexer steps. Bondjet 710/810 with Deep Access delivers the same advanced technology and reliability as the proven combination with 45° rotary bondhead, and ensures that growing demands can efficiently be mastered.

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