Palomar has developed equipment for the manufacture of coaxial laser packages, in which a pulse heat system enables the assembly of edge emitting lasers inside of transistor outline packages (TO cans). Key is a patented eutectic die attach process which precisely heats the metals to the required temperature for bonding, and then performs a controlled cool down that prevents device damage. The system enables void-free attach using many types of solder, including gold and tin-based mixtures. High integrity thermal and electrical connection are needed to generate reliable and stable transmission of laser light. This gear enables optoelectronic manufacturers to meet volume requirements by increasing yield and throughput while reducing costs.
EPP 202
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