Datacon’s inspection system 8000is allows the analysis of 3D image data of solder bumps, wires and post-bonding shoots as well as of glue and solder paste. Measurement is made by means of a 3D laser measuring head over an xy positioning system. A high degree of flexibility is topped by the plug&play feature of all configurable machine elementsl The system inspects up to 300mm wafers as well as all kinds of substrates and lead frames. It is capable of full monitoring ofcritical parameters suchas height and diameterof bumps, coplanarity, shape, presence or incorrectly applied solder balls. Shadow effects, common to automated optical inspection, are reportedly negligible, because of a coaxial construction of light path and detector (confocal principle). Since only reflected light is used for measuring bump heights, stray light from neighboring areas, which can falsify height data in conventional systems based on triangulation, does not impair the signal quality.
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Applikationen aus dem Bereich der Leistungselektronik gewinnen immer mehr an Bedeutung. Die Inspektion dieser Applikation lässt sich mit der bewährten Standardtechnologie der 3D-Messtechnik bewerkstelligen.
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