Amkor expands its development and qualification of 3D (stacked) packages, including the integration of three or more dies and passive devices. These packages cost less, require less handling throughout the manufacturing and mounting process, need less space, have higher reliability and better electrical performance. 3D assembly techniques allow mixing of interconnect technologies within a package. These include die-to-die or die-to-substrate using combinations that can include either wirebond or flip-chip methods. 3D packaging was introduced to allow flash and static RAM chips to be vertically stacked, and now it is emerging as an enabler in systems-in-a-package (SiP) designs. Stacked dies decrease the total system cost by reducing the number of components as well as simplifying the board. Additionally, they reduce the length of interconnects between the devices, enhancing electrical performance as well as final sys-tem application performance. Stacked package volume will approach 230m units this year, according to TechSearch. The firm estimates 50% marketgrowth to 348m packages by the end of 2002.
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