Stencils can now be cut with the LPKF circuit board plotters in polyimide material, right down to fine-pitch structures. An advantage is the very efficient process: a stencil is produced typically in less than 10min. Thickness lies in a range between 75 and 125µm. Due to the high costs of laser-cutting, it has been too expensive to use this method for prototyping or for very small lots. Stencil drilling needs much less time and material than it is necessary for manual soldering or dispensing. Actual production time is reduced down to a tenth, and the stencil is im-mediately available, whereas changes in the layout can be implemented at any time. Another application area where board plotter can be used in prototyping is solder paste printing. For this, LPKF offers instant clamping frames that can be rapidly and flexibly loaded with stencils, together with the printing machineZelFlex LT300.
EPP 181
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