Speedline Camalot introduces their Vortexx vacuum injection system for void-free eBGA underfill. In this two-head injection option, Vortexx is able to process eBGA strips at twice the regular hourly throughput. The typeIV eBGA underfill process applies a vacuum on one side of the strip and injects material between the top and bottom layers of the securing tape. This produces a void-free bond between chip and substrate. With Vortexx, underfill materials with variable – and higher – viscosities can be used. This enables the use of larger die than with conventional eBGA packaging. The system is available with optional external loader and unloader, and well-usable as in-line or stand-alone unit. Floor space is no larger than of a standard dispenser. The system is CE and SEMI S2 compatible.