Eco-Snow Systems‘ WaferClean (distributed in Europe by Macrotron Systems) is an „all-dry“ solution that completely removes process residues without damage for metal lift-off applications, and for cleaning after critical process steps such as CMP and etch in semiconductor processes. The system uses a patented CO2 cleaning technology, which physically processes the wafer surface using a cryogenic aerosol of carbon dioxide particles. This method offers advantages over conventional systems including superior performance, higher yields, reduced cycle times and lower cost of ownership. The WaferClean is fast, environmentally friendly, and a non-contact process system that can be implemented as an alternative to conventional wet processing or as a value-added process step to improve manufacturing yields and reduce solvent usage. The system is CE marked, has a footprint of 50 x 79 x 52-in, and can be bulkhead mounted.
EPP 223
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