The Esec wire bonder 3088 sets industry standards for speed, precision and bond range when considered against the fast moving pace of package miniaturization. Under procuction conditions, the 3088 can perform wire bonding at an accuracy of 60em. This will yield accuracies of 50em. The wire bonder reportedly is faster than comparable models on the market. One of the distinguishing features is a patented, maintenance-free flying bond head. The friction-less moving principle provides long-term consistency. The increased bond range of 2.1 x 2.6-in opens the bonder to a host of demanding applications. It is able to process several devices in one operation cycle of the machine. Fax +41-41-749-5555
EPP 187
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