The matrix tray changer (MTC) increases the capability of the Siplace S-25 HM by changing the components even more efficiently. The MTC is a feed unit with an...
Archiv November 2001
Metcal has launched an enhanced version of its BGA rework system, available in two models: The CSP-3500 is designed for smaller chip-scale rework, and the...
Amkor has expanded its family of low-profile quad flat pack packages to include configurations in 20x20, 24x24 and 28x28mm form factors. The ExposedPad LQFP...
Indium now offers ultra-fine solder wire designed to meet the demanding applications of device packaging. To produce this extra-fine solder wire, the company...
Vitronics Soltec offers an integrated exhaust stack filter for its XPM series reflow soldering ovens. This option filters flux-laden exhaust gases before they...
Users can choose from three now premixed and frozen adhesive formulations. Scotch-Weld 190-PMF Gray from 3M, a flexible adhesive, offers good shear and peel...
BTU's recently introduced Pyramax reflow system improves furnace performance in terms of construction, operation and maintenance. At the same time, it lowers...
Amkor expands its development and qualification of 3D (stacked) packages, including the integration of three or more dies and passive devices. These packages...
Effectively combating ESD demands an understanding of what it is, and how it can be prevented through using the right equipment in an appropriate way. The...
Eco-Snow Systems' WaferClean (distributed in Europe by Macrotron Systems) is an "all-dry" solution that completely removes process residues without damage for...
