The Finetech Fineplacer Pico is an automatic flip-chip bonder and placement system for opto-electronic devices, featuring position accuracy better than 5µm...
Archiv Februar 2002
Assembly and packaging is the bridge between the silicon and the board, creating the functionality of electronic systems. Therefore, packaging design can no...
Manufacturers that use bare dies or flip-chips have access to a wide variety of advanced assembly methods that will produce high yield, high reliability...
The Hesse & Knipps Bondjet 710/810 series of automatic wedge bonders covers all applications using gold, aluminum and copper fine-wire. No longer does the...
The development of ultra-thin packages based on flexible silicon chips will enable applications that will help increase the trend towards even smaller or...
JOT´s Flexi Router, a stand-alone depaneller, is a solutionfor high-mix/medium-volume production requirements. Product changeover can be accomplished simply...
Speedprint Technologies has introduced the enhanced SP200e semi-automatic stencil printer which is said to provide exceptional functionality and flexibility in...
Fuji has introduced the multi-functional SMD placement machine QP-3 with a space saving footprint less than 1.9sqm. Its size, speed and flexibility make it...
Stencils can now be cut with the LPKF circuit board plotters in polyimide material, right down to fine-pitch structures. An advantage is the very efficient...
Assembléon has enhanced its component-mounting systems with improved speed, accuracy, reliability and ease of use. Topaz-XII can place up to 20,000 components...
