Quad has improved the placement process capability of its APS-1 advanced packaging systems. The specification is now ±12 microns @ 3-Sigma repeatability. This...
Archiv September 2000
Speedline Camalot introduces their Vortexx vacuum injection system for void-free eBGA underfill. In this two-head injection option, Vortexx is able to process...
Packaging technology determines the size, weight, ease-of-use, durability, reliability, performance and cost of electronics. As the complexity of devices is...
The Ersa IR 500 A rework station is a complete solution for desoldering and soldering a wide range of components such as SMDs, fine-pitch ICs, BGAs or eBGAs...
The Asys MPS100 magazine buffer has a capacity of up to 100 boards, and features five operation modes (pass-through, FIFO, LIFO, unload and load). It enables...
With the Siplace S 3 x 8mm triple-track and the same overall module width, the number of tracks available, for example, for a S-23 or 80 F5 has increased from...
With the SP28P-DU, Panasonic has developed a printer ca-pable of stable processingof fine pitch of 0.3mm, chip-size packages, chip-scale packages and µBGAs...
Mydata and Electro-Design released a conveyor for in-line automation The conveyours robust design are allowing gentle board handling. Due to their modularity...
Universal announced a 14%increase in the specified in-sertion speed for its Radial8 product line. The increase in speed brings the equipment to 16,000...
OK International has launched the Metcal QX2 hot-air rework system. The system offers a safer, easier and faster solution for the rework of large, high...
